The use of plastic to make chipboard is gaining popularity.
But the new technology could make it a new traditional materials, and it could create a new crop of chipboard-based products.
The new technology is being dubbed “nanostructured plastic,” or NSP.
It uses a thin layer of polyvinyl chloride, or PVC, on top of the plastic to allow for a high density, flexible, and resilient plastic that can be easily woven into fabric.NSP has been used in consumer electronics for decades.
The new technology, however, could change the way the world makes chips.
The NSP-based chips could be made of less plastic than traditional silicon, and could be sold in high-density, flexible materials that can support higher-density manufacturing processes.
The flexible materials could then be sold as chips in a new, more affordable form.
For example, the NSP technology could allow chipmakers to make flexible silicon chips with higher density, but also be able to manufacture high-capacity chips that are less expensive.
As for how this will affect the chip industry, the semiconductor industry is already experimenting with NSP manufacturing.
One chipmaker, TSMC, is using the technology in its chip production, and other chipmakers are beginning to use it as well.
Another chipmaker in China, TSIC, is making chips using the Nsp-based technology in their semiconductor manufacturing process.
The semiconductor sector is expected to take a major hit from the change in chip manufacturing.
According to a study released by McKinsey and Company earlier this year, chip manufacturing will lose about one-third of its jobs in the next decade.
But a large number of those jobs will be in the chip manufacturing and data center sectors, which will be the fastest-growing industries for the next 30 years.